Chu L. Stochastic Finite Element Modeling in Electronic Packaging 2026

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Chu L. Stochastic Finite Element Modeling in Electronic Packaging 2026 (Size: 9.59 MB)
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In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MatLAB and Ansys (APDL) code that can be applied immediately. It also includes robust examples that draw on a comprehensive description of the mechanics of electronic packaging modeling

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