Lau J. Chiplet Design and Heterogeneous Integration Packaging 2023

Textbook in PDF format

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
State-Of-The-Art of Advanced Packaging
Chip Partition Heterogeneous Integration and Chip Split Heterogeneous Integration
Multiple System and Heterogeneous Integration with TSV-Interposers
Multiple System and Heterogeneous Integration with TSV-Less Interposers
Chiplets Lateral Communications
Cu-Cu Hybrid Bonding