Singh A. Outlier Screening For Zero Defect IC Qualit 2001

Textbook in PPT format

Many integrated circuits contain fabrication defects upon manufacture.
Die yields may only be 20-50% for high end circuits.
ICs must be carefully tested to screen out faulty parts before integration in systems.
Small “latent” defects that cause early life failure must also be eliminated.
New “screening” methods address this problem