Tong H , Lai Y , Wong C (Eds ) Advanced Flip Chip Packaging 2013

Textbook in PDF format

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Market Trends: Past, Present, and Future
Technology Trends: Past, Present, and Future
Bumping Technologies
Flip-Chip Interconnections: Past, Present, and Future
Flip Chip Underfill: Materials, Process, and Reliability
Conductive Adhesives for Flip-Chip Applications
Substrate Technology
IC-Package-System Integration Design
Thermal Management of Flip Chip Packages
Thermo-mechanical Reliability in Flip-Chip Packages
Interfacial Reactions and Electromigration in Flip-Chip Solder Joints