| Bonus Resources.txt | 102.4 B | ||
| Get Bonus Downloads Here.url | 204.8 B | ||
| ~Get Your Files Here ! | |||
| 1 - Introduction | |||
| 1. Introduction.en_US.srt | 15.2 KB | ||
| 1. Introduction.mp4 | 152.5 MB | ||
| 2 - MEMS Materials and Process Landscape | |||
| 3 - Core Microfabrication Processes | |||
| 10. Oxidation and the Deal–Grove Model.en_US.srt | 5.7 KB | ||
| 10. Oxidation and the Deal–Grove Model.mp4 | 43.2 MB | ||
| 11. Doping Diffusion vs Ion Implantation.en_US.srt | 4.8 KB | ||
| 11. Doping Diffusion vs Ion Implantation.mp4 | 50.2 MB | ||
| 12. Wet vs Dry Etching (Isotropic vs Anisotropic).en_US.srt | 6.3 KB | ||
| 12. Wet vs Dry Etching (Isotropic vs Anisotropic).mp4 | 53.1 MB | ||
| 4 - Micromachining Strategies | |||
| 13. Bulk Micromachining Techniques.en_US.srt | 7.3 KB | ||
| 13. Bulk Micromachining Techniques.mp4 | 48.4 MB | ||
| 14. Surface Micromachining Flow.en_US.srt | 6.5 KB | ||
| 14. Surface Micromachining Flow.mp4 | 34.5 MB | ||
| 15. Sacrificial Layers and Release.en_US.srt | 7.4 KB | ||
| 15. Sacrificial Layers and Release.mp4 | 44.6 MB | ||
| 16. Wafer Bonding Techniques.en_US.srt | 7.6 KB | ||
| 16. Wafer Bonding Techniques.mp4 | 68.6 MB | ||
| 5 - High Aspect Ratio MEMS | |||
| 17. LIGA Process Fundamentals.en_US.srt | 10.2 KB | ||
| 17. LIGA Process Fundamentals.mp4 | 78.7 MB | ||
| 18. X Ray Lithography and Electroforming.en_US.srt | 8.5 KB | ||
| 18. X Ray Lithography and Electroforming.mp4 | 94.6 MB | ||
| 19. UV LIGA (SU 8) and Trade Offs.en_US.srt | 4.5 KB | ||
| 19. UV LIGA (SU 8) and Trade Offs.mp4 | 22.2 MB | ||
| 20. Applications of High Aspect Ratio MEMS.en_US.srt | 4.7 KB | ||
| 20. Applications of High Aspect Ratio MEMS.mp4 | 34.2 MB | ||
| 6 - Packaging Testing and Reality | |||
| 21. Why Packaging Dominates MEMS Cost.en_US.srt | 8.1 KB | ||
| 21. Why Packaging Dominates MEMS Cost.mp4 | 59.5 MB | ||
| 22. Wafer Level vs Die Level Packaging.en_US.srt | 3.9 KB | ||
| 22. Wafer Level vs Die Level Packaging.mp4 | 36.5 MB | ||
| 23. Wire Bonding vs Flip Chip.en_US.srt | 5 KB | ||
| 23. Wire Bonding vs Flip Chip.mp4 | 31.9 MB | ||
| 24. Testing MEMS Devices (Pressure Acceleration Fluids).en_US.srt | 5.8 KB | ||
| 24. Testing MEMS Devices (Pressure Acceleration Fluids).mp4 | 59.6 MB | ||
| 25. Reliability Yield and Industrial Constraints.en_US.srt | 7.3 KB | ||
| 25. Reliability Yield and Industrial Constraints.mp4 | 78.7 MB | ||
| 7 - Closing | |||
| 1. Final Assessment.html | 10.1 KB | ||
| 26. Closing.en_US.srt | 3.8 KB | ||
| 26. Closing.mp4 | 11 MB | ||
| 8. Photolithography (Positive vs Negative).en_US.srt | 8.9 KB | ||
| 8. Photolithography (Positive vs Negative).mp4 | 59.3 MB | ||
| 9. Thin Film Deposition (CVD PVD Electroplating).en_US.srt | 9.8 KB | ||
| 9. Thin Film Deposition (CVD PVD Electroplating).mp4 | 103 MB | ||
| 4. MEMS Fabrication Categories.en_US.srt | 14.4 KB | ||
| 4. MEMS Fabrication Categories.mp4 | 152.3 MB | ||
| 5. Silicon Polymers Ceramics and Carbon MEMS.en_US.srt | 10.6 KB | ||
| 5. Silicon Polymers Ceramics and Carbon MEMS.mp4 | 135.9 MB | ||
| 6. Bulk vs Surface Micromachining Overview.en_US.srt | 12.8 KB | ||
| 6. Bulk vs Surface Micromachining Overview.mp4 | 127.7 MB | ||
| 7. What MUMPs Is and Why It Exists.en_US.srt | 4.9 KB | ||
| 7. What MUMPs Is and Why It Exists.mp4 | 47.6 MB | ||
| 2. Course Structure & Syllabus.en_US.srt | 9.2 KB | ||
| 2. Course Structure & Syllabus.mp4 | 40.5 MB | ||
| 3. Specialization Options.en_US.srt | 4.1 KB | ||
| 3. Specialization Options.mp4 | 35.2 MB |
Microelectromechanical Systems III: Fabrication Fundamentals
https://WebToolTip.com
Published 1/2026
MP4 | Video: h264, 1920x1080 | Audio: AAC, 44.1 KHz, 2 Ch
Language: English | Duration: 3h 12m | Size: 1.66 GB
MEMS Fabrication, Packaging, and Industrial Practice
What you'll learn
Differentiate between bulk and surface micromachining strategies to select the appropriate fabrication flow for complex three-dimensional micro-structures.
Analyze core microfabrication processes—including photolithography, thin-film deposition, and anisotropic etching—to predict their impact on device geometry
Execute a multi-user MEMS process (PolyMUMPs) design flow, utilizing sacrificial layer release techniques and established design rules
Evaluate industrial packaging and testing constraints, addressing why housing and physical stimuli requirements often dominate the total cost and reliability
Requirements
B.S or graduate students, Mechanical engineering, Manufacturing Engineering, Aerospace Engineering, Electronics Engineering, Physics, Technicians with industry experience.
| torrent name | size | uploader | age | seed | leech |
|---|---|---|---|---|---|
| 2 GB | freecoursewb | 4 months | 12 | 5 |
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